Adani and Jabil plan 50:50 JV to make AI data center hardware in India
DigiTimes: IT news from Asia
CEATEC 2026 showcases physical AI, smart infrastructure
DigiTimes: IT news from Asia
Yaskawa targets 2030 humanoid robot rollout as AI lifts forecast
DigiTimes: IT news from Asia
Qualcomm says edge AI faces power, cost, and scale hurdles
DigiTimes: IT news from Asia
KYEC signs advanced payment deal with Nvidia for US testing expansion
DigiTimes: IT news from Asia
Samsung integrates AI into daily life as LG showcases smart factories, data-center cooling
DigiTimes: IT news from Asia
Apple's new home devices tie Siri AI to subscriptions and newer iPhones
DigiTimes: IT news from Asia
Apple launches HomeView display, rebuilding home lineup around Siri AI
DigiTimes: IT news from Asia
MiTAC spotlights liquid cooling, open platforms for AI infrastructure
DigiTimes: IT news from Asia
SK Hynix, Micron confront AI memory bottlenecks with HBM standardization, chip integration
DigiTimes: IT news from Asia
TSMC, Intel, Samsung seek to break AI chipmaking's next barrier through early technology integration
DigiTimes: IT news from Asia
Pegatron showcases rack-scale AI infrastructure at OCP Global Summit
DigiTimes: IT news from Asia
China's AI chipmakers target 3D packaging, optical interconnects and software ecosystems
DigiTimes: IT news from Asia
GlobalFoundries revives 7nm-class ambitions with an EUV-free FD-SOI bet on physical AI
DigiTimes: IT news from Asia
Foxconn unveils Vera Rubin AI racks, liquid-cooling systems at OCP Summit
DigiTimes: IT news from Asia
TSMC-GF interposer deal reshapes US AI supply chain, from CoWoS to HBM
DigiTimes: IT news from Asia
Shield AI delivers first V-BAT drone to Taiwan Coast Guard
DigiTimes: IT news from Asia
AI memory boom pushes smartphone market into premium-first reset
DigiTimes: IT news from Asia
